DEMCOMELT 70051

DEMCOMELT 70051 is a white metallocene coolmelt adhesive featuring low application temperature and excellent mileage across carton converting, corrugated packaging, and end-of-line applications. This advanced formulation handles difficult surfaces whilst offering deep freeze performance for cold chain packaging, combining energy efficiency with reliable bonding on challenging substrates.

Product Overview
  • Low application temperature saves energy
  • Metallocene technology for superior performance compared to standard EVA products
  • Bonds difficult surfaces including coated boards and treated materials reliably
  • Excellent mileage provides cost savings and reduces adhesive consumption
  • Deep freeze performance maintains bond strength at low temperatures
  • White colour provides clean appearance on finished packages

 

DEMCOMELT 70051 brings energy efficiency to packaging operations without compromising performance, suitable for temperature-sensitive substrates and frozen food applications.

Product benefits

Metallocene Technology

Metallocene hot melts represent advanced chemistry offering superior performance compared to standard EVA products. Metallocene polymers are produced using advanced catalysts that create more uniform molecular structure compared to conventional EVA. This results in adhesives with improved performance including better flexibility at low temperatures, stronger bonding to difficult surfaces, higher cohesive strength, cleaner application with less charring at temperature, and cleaner operation. The chemistry provides good wetting and adhesion on surfaces that often resist standard hot melts.

Energy Efficiency

Operating at application low temperatures compared to standard hotmelts at 160-180°C delivers measurable energy savings. The low application temperature significantly reduces energy consumption in melting equipment compared to standard hot melts. For operations running multiple shifts or several packaging lines, the reduced heating requirement translates to lower electricity costs month after month whilst reducing the environmental footprint of your packaging operations and equipment wear from thermal stress.

Temperature-Sensitive Substrates

Some packaging materials degrade, warp, or discolour when exposed to high temperatures. Coolmelt technology allows bonding of these sensitive substrates without damage. This expands the range of materials you can use whilst maintaining packaging integrity and appearance, allowing safe use with materials that cannot tolerate high heat.

Product Overview

DEMCOMELT 70051 represents metallocene hot melt technology applied to packaging applications, representing a different approach to hotmelt adhesive technology.

This product is more viscous than standard hot melts but the viscosity decreases with temperature – running at higher temperatures reduces viscosity for faster application. The low-end temperature capability makes this one of the coolest-running hot melts available, whilst the high-end range provides flexibility for demanding applications. The higher viscosity at lower temperatures requires proper equipment setup.

The white colour distinguishes metallocene products from yellow EVA formulations and provides cleaner appearance on packaging, maintaining a clean appearance on finished packages and light substrates. The formulation is optimised for packaging applications where goods will face refrigerated storage or frozen distribution. For high-volume operations, this translates to meaningful cost savings. This adhesive meets food safety requirements for indirect food contact packaging applications.

Sector & Solutions

Folding Cartons, Corrugated Packaging, Paper Cups, End of Line Packaging

Product Type

Hotmelt Adhesive

Colour

White

Application Method

Bead, Slot Nozzle, Wheel, Spray

Viscosity

N/A

Solids Content

N/A

Application Temp

120-180°C

Performance Category
Form

Pellets, Pillows

Substrates

Films, Temperature-Sensitive Materials, Treated Substrates, Cardboard, Difficult Substrates, Paper, Coated Board

white hotmelt pillows

Safety details

Follow standard safety protocols for hotmelt adhesive handling when working with DEMCOMELT 70051. Although application temperatures are lower than traditional hotmelts, thermal protective equipment is still required for operators near application systems or performing maintenance. Wear appropriate heat-resistant protective equipment including gloves. Ensure hot melt equipment has proper temperature controls and safety features, and that temperature controls function accurately. Maintain adequate ventilation in working areas to remove any fumes, even though lower application temperatures reduce fume generation.

This adhesive meets food safety requirements for indirect food contact packaging applications. Store in sealed containers in cool, dry conditions away from heat sources, ignition sources, and incompatible materials. If molten adhesive contacts skin, immediately cool the affected area with cold running water and obtain medical treatment for burns. Do not attempt to peel adhesive from skin and seek medical attention. Keep appropriate firefighting equipment available in storage and application areas. Refer to the Safety Data Sheet for complete handling, emergency procedures, and first aid measures.

Additional information

DEMCOMELT 70051’s wide temperature range offers flexibility to balance energy savings against performance requirements. Start at lower temperatures for maximum energy savings and increase as needed based on line speed, substrate type, and bonding requirements. Low-temperature application reduces energy costs but increases viscosity; higher temperatures reduce viscosity for faster lines and application but increase energy use. Lower temperatures produce higher viscosity, which may affect spray patterns or bead formation on some equipment. For difficult surfaces, running at higher temperatures may improve wetting. Monitor performance and adjust temperature to achieve optimal results for your specific application. Trial across the range to find optimal balance for your operation. Verify hot melt equipment temperature accuracy regularly.

The excellent mileage means you can often reduce application weight compared to EVA products whilst maintaining bond strength. For deep freeze and frozen food applications, allow adequate cooling time before exposing packages to cold temperatures, and verify performance at your coldest storage temperatures and duration conditions before committing to production. Substrates should be clean and dry.

Store adhesive in original sealed packaging in cool, dry conditions away from direct sunlight and moisture. This adhesive is compatible with standard hotmelt equipment. Some equipment may require temperature controller adjustments to accommodate the lower operating range. Consult equipment manufacturers for specific recommendations. Clean equipment with appropriate hot melt cleaning products whilst equipment remains warm.

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